PCB stack-up
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4 layers Rigid PCB stack up
Our standard multi-layer PCB stackup is predominantly made up of three components with varying thicknesses of Copper Foil, Pre-preg and Copper clad FR4 laminates as cores. -
4 layers FPC stack-up
4 layers Flexible circuit boards stack-up , PI ,base copper with or without adhesive,overlay , the thickness is from 0.15mm-0.5mm -
Blind Vias: Connects an inner layer with the adjacent surface layer, they are only visible on one side of the boards and so are called ‘blind’ vias. Buried Vias: Connects two adjacent inner copper layers. They are not visible from the surface and so are ‘buried’.
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Copper in the wall of PTH: The thickness of copper in the wall of PTH hole as 25 at least. -
Side Plating
To guarantee the producibility of the sideplating, the metallized area must be defined using overlapping copper (copper surface, pads, or tracks) in the CAD layout. Minimum overlap:500mm
On the connected layer, min 300um of connected copper must be defined.
On non-connected layers, the copper should have gap of min. 800um from the outer contour.
