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8-Layer Green Solder Mask PCB
8-Layer Green Solder Mask PCB
| Base Material: | FR4-TG170 |
| Layers: | 8 layers |
| Dielectric Constant: | 4.2 |
| Board Thickness: | 1.6mm |
| Outer Layer Copper Thickness: | 1OZ |
| Inner Layer Copper Thickness: | 1OZ |
| Surface Finish: | ENIG (Electroless Nickel Immersion Gold) |
| Minimum Hole Diameter: | 0.25mm |
| Minimum Line Width: | 0.1mm |
| Minimum Line Spacing: | 0.1mm |
| Application Field: | Communications |
| Features: | High Precision Impedance Board |






