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8-Layer Green Solder Mask PCB
8-Layer Green Solder Mask PCB
Base Material: | FR4-TG170 |
Layers: | 8 layers |
Dielectric Constant: | 4.2 |
Board Thickness: | 1.6mm |
Outer Layer Copper Thickness: | 1OZ |
Inner Layer Copper Thickness: | 1OZ |
Surface Finish: | ENIG (Electroless Nickel Immersion Gold) |
Minimum Hole Diameter: | 0.25mm |
Minimum Line Width: | 0.1mm |
Minimum Line Spacing: | 0.1mm |
Application Field: | Communications |
Features: | High Precision Impedance Board |