PCB FABRICATION · SOURCING · ASSEMBLY

PCB Assembly Services

GreatPCB provides printed circuit board assembly services for prototypes, pilot builds and production orders. Bring PCB fabrication, component sourcing, SMT and through-hole assembly into one project, with programming, inspection and testing defined around your board requirements.

Send your Gerber files, bill of materials and build quantity to discuss the assembly scope, material availability and next steps.

PCB assembly from the existing GreatPCB assembly page

Assembly Capabilities

From surface-mount components to connectors, cables and enclosures, the assembly route depends on what your product needs. Share the board layout and component list so we can review package compatibility, assembly access and any special handling before production.

SMT and BGA Assembly — existing GreatPCB page image

SMT and BGA Assembly

Surface-mount technology (SMT) places components onto solder-paste deposits before reflow soldering. GreatPCB supports single- and double-sided SMT assembly, including BGA and other fine-pitch packages.

For BGA devices, the review also considers the land pattern, nearby components, thermal requirements and inspection access. Hidden joints need an inspection approach suited to the package; a visible surface check alone cannot assess them.

See our SMT capabilities and BGA assembly services for more detail.

Through-Hole and Mixed Assembly — existing GreatPCB page image

Through-Hole and Mixed Assembly

Through-hole assembly is used for components with leads inserted through the PCB, such as many connectors, transformers and larger power components. Mixed assembly combines these parts with surface-mount devices on the same board.

Soldering methods depend on component access, thermal limits and the surrounding layout. Identify parts with special mounting, lead-forming or temperature requirements in the assembly drawing so they can be included in the process review.

Flex, Rigid-Flex and Product Assembly — existing GreatPCB page image

Flex, Rigid-Flex and Product Assembly

Flexible and rigid-flex boards require attention to support, handling and component placement near flexible sections. Provide the assembled shape, stiffener details and any bend restrictions alongside the fabrication data.

For products that extend beyond the PCB, GreatPCB also offers cable and enclosure integration through box-build assembly. Mechanical drawings and connection instructions help define where board assembly ends and product assembly begins.

Assembly requirementService scopeInformation to review
Surface-mount componentsSingle- or double-sided SMT, including BGA packagesBOM, placement data, package details and thermal restrictions
Through-hole componentsLeaded component insertion and soldering; mixed SMT/THT buildsAssembly drawing, mounting details and soldering access
Flexible boardsFlex and rigid-flex assemblyBoard support, stiffeners, assembled geometry and handling limits
Product integrationProgramming, cables, enclosure assembly and specified testingFirmware, wiring and mechanical drawings, test instructions

Turnkey and Consigned Assembly

Choose the material arrangement around the parts you already have and the purchasing work you want GreatPCB to handle. The project review establishes who supplies the bare boards and each BOM item before procurement or assembly begins.

Full Turnkey

With full turnkey assembly, GreatPCB coordinates PCB fabrication, component sourcing and assembly within the agreed scope. You provide the released design files, purchasing requirements and approvals. This gives you one project contact for the board and its assembly materials.

Partial Turnkey

Partial turnkey combines selected customer-supplied parts with components sourced by GreatPCB. It can suit projects where you already hold critical devices or need to retain purchasing control over particular items.

Mark the supply responsibility for each BOM line. A part listed twice, or left without an owner, can create unnecessary purchasing and scheduling problems.

Consigned Assembly

For a customer-supplied kit, review board and component acceptance before shipping. Provide a packing list that matches the BOM, component quantities and packaging details. Include the handling history of opened moisture-sensitive parts where applicable.

ArrangementBare boardsComponentsCustomer preparation
Full turnkeyGreatPCB supplies within the agreed fabrication scopeGreatPCB sources agreed BOM itemsRelease files and approve purchasing requirements
Partial turnkeySupply responsibility agreed for the projectSplit between GreatPCB and customerIdentify who supplies each item and confirm arrival dates
ConsignedCustomer supply, subject to acceptance reviewCustomer supply, subject to kit reviewProvide a complete packing list, suitable packaging and agreed spare quantities

Our component sourcing service covers BOM review and purchasing coordination. Specify manufacturer part numbers, do-not-populate positions and any approved alternatives. Similar packaging or a matching nominal value alone does not establish that a substitute is suitable for your circuit.

From Prototype to Production

Each build stage answers a different question. A prototype checks the design; a pilot build checks how it will be manufactured; repeat production follows the approved materials and process.

Prototype assembly

Establish the correct revision, resolve assembly questions and define the checks needed for design evaluation. Agree whether a first article needs customer approval before the remaining boards are assembled.

Pilot and low-volume assembly

Use the build to identify recurring assembly or test issues, confirm work instructions and prepare fixtures where needed. Record the changes before increasing quantities. Our low-volume PCB assembly service supports this transition.

Repeat production

Build against the approved BOM, fabrication files, assembly instructions and test requirements. When a revision changes, identify its effective build and review the effect on purchased parts and work already in progress.

For quick-turn PCB assembly, share the required delivery date early. Feasibility depends on usable material availability, file approval, production scheduling and the testing scope; placement time is only one part of the schedule.

PCB Assembly Process

The following sequence shows the main stages. Double-sided boards and mixed assemblies may require additional passes, while programming, cleaning and coating are included according to the project plan.

1. File Review and Material Preparation

Review the PCB data, BOM, placement file and assembly drawing together. Resolve mismatched reference designators, unclear polarity and component substitutions before releasing the build. Material preparation also checks the supplied quantities, packaging and applicable handling requirements.

2. Solder Paste Printing and SMT Placement

A stencil deposits solder paste on the required pads. Solder paste inspection (SPI), where specified, checks the deposits before components obscure them. Placement equipment then positions the surface-mount parts using the approved program and component data.

Solder Paste PrintingSolder paste deposition before component placement.
SMT PlacementPositioning surface-mount components before reflow.

3. Reflow Soldering

The populated board passes through a controlled heating and cooling cycle to form the SMT solder joints. Profile development accounts for the solder paste, component limits and the board’s thermal response. An oven setting alone does not establish the temperatures experienced across an assembly.

Reflow SolderingThe controlled thermal stage used to form SMT solder joints.

4. Through-Hole Assembly

Leaded components are inserted and soldered using a suitable method. Wave soldering forms joints as the underside of the board contacts a wave of molten solder; it is a different process from reflow soldering. Board layout, nearby SMT components and heat-sensitive parts affect the method and any protection required.

Wave SolderingA through-hole soldering process selected according to the assembly design.

5. Inspection and Project-Specific Testing

Inspect the assembly at the agreed stages and carry out the specified electrical or functional checks. Optical inspection, X-ray and electrical testing address different questions, as shown below. Where programming is included, use the approved firmware version and programming settings.

AOI InspectionOptical inspection of programmed, visible assembly features.
X-ray InspectionInspection for suitable hidden solder structures; scope depends on the package and inspection plan.
Flying Probe TestingElectrical checks using programmed probe access; coverage is project-specific.

6. Coating and Final Preparation

If conformal coating is required, define the material, coverage and keep-out areas before processing. Surface preparation must suit the assembly and coating system. Connectors, contacts and other excluded areas need protection according to the drawing. Complete the agreed final checks and packaging before shipment.

Conformal CoatingAn optional protective process with specified coverage and exclusions.

Inspection and Testing

GreatPCB’s published assembly processes include SPI, AOI and X-ray, alongside electrical and functional testing options. The inspection and test plan should identify what needs checking, the acceptance criteria and any records required with delivery.

Process and Solder Joint Inspection

SPI assesses solder-paste deposits. Automated optical inspection (AOI) examines visible component and solder-joint features covered by its program. X-ray can assess suitable hidden solder structures, including joints beneath BGA packages.

These methods complement one another. X-ray interpretation depends on the package, viewing geometry and inspection conditions; an image does not establish that firmware, interfaces or every electrical function work correctly.

Electrical and Functional Testing

Electrical testing checks the connections or parameters included in the test program. Functional testing operates the assembly under defined conditions and compares the response with specified pass/fail limits.

MethodMain purposeRequirements and limits
SPIAssess solder-paste position and deposit geometryUses the printing requirements; does not verify the final reflowed joint
AOIIdentify covered, visible placement and soldering anomaliesDepends on visibility and programming; cannot directly inspect all hidden joints
X-rayExamine suitable hidden solder structuresNeeds defined inspection locations and criteria; does not replace functional testing
ICT or flying probeCheck accessible electrical connections or component parametersRequires suitable test access and test data; method and coverage need review
Functional testingVerify specified board behaviorRequires operating conditions, firmware where applicable, expected results and pass/fail limits

For functional testing, provide the required power sources, loads, interface connections and test sequence. Identify any fixtures or software you will supply. Environmental or life testing requires a separate specification; passing an assembly test does not establish untested long-term reliability.

You can also view our PCB assembly factory for further manufacturing information.

Files for PCB Assembly

Start with the Gerber files, BOM and quantity for an initial review. Before production, the documents need to describe the same approved revision and include the instructions required for the work you are ordering.

File or requirementWhat to include
PCB fabrication dataGerber and drill files, fabrication drawing, stackup, material, copper and finish requirements when board fabrication is included
Bill of materialsManufacturer and part number, reference designators, quantity per board, DNP positions and substitution restrictions
Placement file / CPLReference designator, X/Y position, rotation, board side and coordinate convention
Assembly drawingComponent orientation, polarity, special mounting, mechanical constraints and instructions not clear from placement data
Build informationQuantity, revision, requested date, material supply responsibilities and first-article approval requirements
Programming files, if requiredDevice part number, approved firmware version, file format, programming settings and verification instructions
Test requirementsTest procedure, operating conditions, equipment or fixture needs, pass/fail limits and required records
Additional operationsCoating areas and exclusions, cable drawings, enclosure details, labels and packaging instructions as applicable

For IC programming, identify any configuration, security or locking settings that affect programming and verification. These instructions need review before the build, especially where a setting cannot be reversed.

Discuss Your PCB Assembly Project

Send your files and tell us which materials you will supply. GreatPCB can review the assembly requirements, identify outstanding questions and discuss a production plan with you.

FAQs

Component cost and availability, board quantity, placement count, package complexity and the required operations all affect the quote. Setup, fixtures, programming and testing can also change the cost. See our PCB assembly cost guide for a breakdown of the main variables.

Confirm the starting milestone in the quotation. Production scheduling depends on approved files, usable materials and any required tooling or test preparation. Component procurement and shipping may be separate from the quoted assembly time. Our PCB assembly lead time guide explains these stages.

Yes. State your substitution policy in the BOM and review proposed alternatives before they are purchased or used. Approval should identify the exact replacement part and the affected BOM revision. Where performance depends on the circuit or firmware, include the necessary design validation.

They can be included after reviewing the device, files, equipment compatibility and test requirements. Provide the firmware and programming instructions, plus a functional test procedure with clear acceptance limits. Programming verification and functional testing should each have their own defined result.