BGA Assembly Services

Our BGA assembly service fits within a complete PCB assembly project, including surrounding surface-mount components and through-hole parts where required.

• BGA and micro-BGA: Fine-pitch assembly down to 0.2 mm pitch, subject to review of the actual package, PCB design and process requirements.
• Prototype through production: Small builds for design validation, low-volume orders and repeat production, with requirements confirmed for each revision.
• Single- and double-sided assembly: Board layout, component size and assembly sequence are considered together, including projects with BGAs on both sides.
• Component sourcing and testing: Procurement, SPI, AOI, X-ray inspection and electrical or functional testing can be included according to the agreed project scope.

See our SMT capabilities for the published assembly specifications. Include the BGA manufacturer part number when requesting a review: ball pitch alone does not establish whether a complete board is ready for assembly.

Resolve footprint and material questions before the PCB and stencil are released. Changes at this stage can prevent a soldering problem from becoming a board revision or a rework job.

Start with the component manufacturer’s recommended land pattern. Check the copper pad, solder-mask opening and stencil aperture separately; they serve different purposes and should not be treated as interchangeable dimensions.

With a non-solder-mask-defined (NSMD) pad, the mask opening is larger than the copper pad. With a solder-mask-defined (SMD) pad, the mask overlaps the copper and defines the exposed soldering area. Select the arrangement for the actual device and board requirements rather than applying one rule to every BGA.

Fan-out must leave enough room for traces, clearances and via capture pads. As pitch decreases, the available routing space becomes tighter, and the design may need smaller vias, additional routing layers or HDI structures. An open via inside a solder pad can draw solder away during reflow; specify the required filling and capping treatment with the PCB fabricator. Solder-mask tenting and a filled, copper-capped via are different constructions.

For a device-specific reference, NXP’s BGA assembly guidance explains pad and routing-via considerations. Our HDI PCB design guide covers the wider stackup and escape-routing decisions.

Confirm the BGA part number, orientation, package drawing and solder-ball alloy alongside the PCB files. For customer-supplied components, include moisture-barrier packaging information and any available opening or storage records. Handle moisture-sensitive parts according to their specified moisture sensitivity level (MSL) and exposure history. Confirm whether drying or baking is needed from those instructions and the exposure record.

Also identify double-sided assembly, large thermal masses, heat-sensitive components and restricted access around the BGA. These affect assembly sequence, thermal profiling and the feasibility of later rework.

The process connects the supplied BGA package to the PCB. Each stage has a control point before the next stage begins.

1. Prepare the job and materials. Reconcile the BOM, placement data and assembly drawing. Confirm component orientation, board revision and any special handling instructions.
2. Print and check solder paste. The stencil controls where paste is deposited and how much reaches each pad. SPI checks deposits before placement so printing problems can be addressed before the joints are hidden.
3. Place the BGA. Machine vision supports alignment of the package and board. Placement settings must suit the device without damaging the package or disturbing the paste deposits.
4. Reflow and cool. Develop the thermal profile around the solder paste, component limits and board construction. The measured temperatures at the assembly matter; oven settings alone do not describe the temperature experienced by every joint.
5. Inspect and test. Check the assembly using the agreed inspection and test methods. Investigate suspect results before deciding whether rework is necessary.

BGA inspection needs more than a view of the component’s top surface. X-ray imaging helps assess hidden joints, while optical inspection and electrical testing answer different questions.

Head-in-pillow is one reason these methods must be chosen carefully: a solder ball and paste deposit may appear connected without forming a sound joint. Suspect indications may need another viewing angle or further analysis. Inspection coverage, acceptance criteria and any required records should be agreed before production.

See assembly inspection and testing for the wider test options.

BGA assembly cost and turnaround depend on the complete build, not just the number of BGA devices.

• Quantity and setup: Stencil preparation, programming and process setup are shared across the order, so they carry more weight in a small batch.
• Component availability: A ready PCB cannot move through assembly if a required BGA or another critical part is missing. Confirm exact part numbers and approve substitutions before purchasing.
• Board and package complexity: Fine pitch, dense placement, double-sided construction and special handling can add preparation and process requirements.
• Inspection and testing: Test fixtures, programming, inspection coverage and investigation of suspect joints affect both the work scope and schedule.

Send complete files early so the quote can account for these requirements. Our PCB assembly cost and assembly lead-time guides explain the main planning factors; component sourcing covers procurement preparation.

Have an existing board that needs BGA removal or replacement? Send the device part number, board photographs, fault description and any previous rework history for a feasibility review. Pad condition, nearby components, coatings or underfill, and prior heat exposure can change what is practical. Any proposed repair also needs a suitable inspection and test plan.

Provide the following so the project can be assessed against the actual board and component requirements:

• PCB files: Gerber and drill files, fabrication notes and stackup where relevant.
• Assembly data: BOM with manufacturer part numbers, pick-and-place coordinates, assembly drawings and the current revision.
• BGA details: Exact device numbers, package drawings and any manufacturer assembly instructions or special handling requirements.
• Build requirements: Quantity, target delivery date and whether components are supplied by you or sourced by GreatPCB.
• Inspection and testing: Required acceptance criteria, programming files, test procedures, fixtures and any inspection records needed with delivery.