The selection of printed circuit board material is very important and plays a key role in the performance and function of the equipment.The selection of PCB materials is determined by the cost, operating environment requirements, application, thermal management and signal integrity requirements. The following are several PCB materials commonly used in industry:

The FR-4 glass fiber and epoxy resin board

FR-4 glass fiber and epoxy resin board is the most common PCB board, which is composed of epoxy resin as adhesive and electronic grade glass fiber cloth as reinforced material.


Good insulation performance, suitable for most applications.

High mechanical strength, good heat resistance.

Corrosion-resistant, can resist the corrosion of many chemicals.

Good essability, suitable for conventional PCB manufacturing process.


General electronic equipment, consumer electronic products, medical electronic products, communication equipment, etc.

Ceramic substrate

Ceramic substrate is a special process plate with copper foil directly bonded to the surface of a ceramic substrate (single or double sided) of alumina (Al2O3) or aluminum nitride (AlN) at high temperature.


Good high-frequency characteristics, which can maintain a stable electrical performance in the high-frequency environment.

Excellent insulation performance, better than the FR-4.

High temperature resistance, with a relatively good high temperature resistance performance.


RF and microwave circuit, antenna modules and other high-frequency fields.

Aluminum substrate

Aluminum substrate is generally composed of three layers, namely, circuit layer (copper foil), insulation layer and metal base.


Excellent heat dissipation performance, suitable for the heat dissipation requirements of high-power electronic devices. High mechanical strength, with higher strength relative to conventional FR-4 materials. Corrosion resistance, aluminum substrate has better corrosion resistance.


High power LED lighting, power amplifier, power supply module and other high power electronic devices.


Flexible board

Flexible board is a printed circuit board made of flexible insulation substrate (mainly polyimide or polyester film), commonly known as FPC.


Better flexibility and foldable for electronics that require bending or compact design.


Wearable devices, medical devices, and automotive electronics.

Teflon board


The thermal conductivity is very low and has excellent performance in the high temperature and high frequency environment .


Because of the high price, it is used relatively little, but it is used in specific high temperature and high frequency fields.

High frequency board(such as Rogers、Taconic


Excellent high frequency characteristics, able to maintain extremely low signal capture in the high frequency environment. Excellent insulation performance, with excellent insulation performance.


5G communication, radar systems, satellite communications and other high-frequency fields.


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PCB materials comparison
Material type Tg (0C) Dk (@1MHz) Application
FR4 135-140 4.2-4.8 Standard
FR4 150-170 4.5-4.8 Standard/lead free
FR4 180-220 3.4-3.8 (@1GHz) High speed
PTFE 160 2.2-2.8 RF-Radio Frequency
Polyimide ≥250 3.8-4.2 High temperature use