Key parameters of the FR 4 substrate material in the PCB?

Key parameters of the FR 4 substrate material in the PCB?

FR 4 substrate material is a kind of substrate material widely used in electronic PCB products. Great PCB is a circuit board supplier and offers PCB fabrication assembly service, we will deeply explore the parameters of FR 4 substrate materials, Including dielectric constant, thermal expansion coefficient, glass transition temperature, and electrical breakdown strength. To help understand the properties of FR 4 substrate materials and their important role in electronic products.

1、dielectric constant

The dielectric constant is one of the important parameters to measure the electrical insulation properties of materials. For the FR 4 substrate material, its dielectric constant determines the propagation speed and wavelength of the electromagnetic wave in the material for the PC board. The smaller the dielectric constant, the faster the frequency of the electromagnetic wave in the material. When the dielectric constant of FR 4 substrate material approaches 1, This value is very important for circuit board designers. the impedance matching performance is better, which can improve the speed and quality of signal transmission.

2、thermal expansivity

The thermal expansion coefficient is one of the key parameters to measure the length change of materials under temperature change. For the FR 4 substrate material, the thermal expansion coefficient determines whether the deformation will occur under the temperature change, which affects the stability and reliability of the electronic products. Reasonable control of the thermal expansion coefficient of the FR 4 substrate material can avoid the stress concentration and the mismatch between the components caused by the temperature change.

3、glass-transition temperature

The glass transition temperature is the critical temperature of the material transition from the glassy to the solid state. For the FR 4 substrate materials, the glass transition temperature determines the mechanical properties and insulation properties of the material under high-temperature conditions. High glass transition temperature can ensure that FR 4 substrate materials can maintain good physical and electrical properties in a high-temperature environment, and improve the reliability and stability of electronic circuit board products.

4、Resistance to electrical breakdown strength

Electrical breakdown strength refers to the maximum voltage the material can withstand under the action of the electric field. For FR 4 substrate materials, their electrical breakdown strength determines the insulation ability and reliability of the material. High electrical breakdown resistance means that the material can withstand a higher working voltage and can PCB circuit effectively prevent equipment damage or failure caused by electrical breakdown.

As FR 4 substrate material is commonly used in printed circuit boards, its key parameters have an important influence on product performance. Dielectric constant, thermal expansion coefficient, glass transition temperature, and electrical breakdown strength are important indicators to measure the material performance of FR 4 substrate. By controlling these parameters reasonably, the signal transmission speed, stability, and reliability of electronic products can be improved. In future applications, the study and further optimization of the key parameters of FR 4 substrate materials will be an important direction to provide better support and guarantee for the development of electronic products.

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