8-layer high-density interconnect (HDI) PCB

8-layer high-density interconnect (HDI) PCB

Number of Layers8 Layers
MaterialFR-4, TG150
Board TypeHigh-Density PCB
Copper Thickness1 oz
Surface FinishENIG (Electroless Nickel Immersion Gold)
Minimum Trace Width/Spacing3.5/3.5 mil
Drill Hole SizeMinimum Drill Hole Size 0.20mm
Solder Mask ColorBlue
Silkscreen ColorWhite
Operating Voltage2V to 11V
Current CapabilityUp to 1.5A per Channel
Control InterfacesPWM Input, Direction Control, Enable Signal
Low Power ModeSleep Mode for Reduced Standby Power
Operating Temperature-40°C to 125°C
Impedance10 groups
FeaturesH-Bridge Driving, Overcurrent Protection, Thermal Shutdown, Short Circuit Protection
Application AreaConsumer Electronics