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8-layer high-density interconnect (HDI) PCB
8-layer high-density interconnect (HDI) PCB
Number of Layers | 8 Layers |
Material | FR-4, TG150 |
Board Type | High-Density PCB |
Copper Thickness | 1 oz |
Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
Minimum Trace Width/Spacing | 3.5/3.5 mil |
Drill Hole Size | Minimum Drill Hole Size 0.20mm |
Solder Mask Color | Blue |
Silkscreen Color | White |
Operating Voltage | 2V to 11V |
Current Capability | Up to 1.5A per Channel |
Control Interfaces | PWM Input, Direction Control, Enable Signal |
Low Power Mode | Sleep Mode for Reduced Standby Power |
Operating Temperature | -40°C to 125°C |
Impedance | 10 groups |
Features | H-Bridge Driving, Overcurrent Protection, Thermal Shutdown, Short Circuit Protection |
Application Area | Consumer Electronics |