Product >>
8-layer high-density interconnect (HDI) PCB
8-layer high-density interconnect (HDI) PCB
| Number of Layers | 8 Layers |
| Material | FR-4, TG150 |
| Board Type | High-Density PCB |
| Copper Thickness | 1 oz |
| Surface Finish | ENIG (Electroless Nickel Immersion Gold) |
| Minimum Trace Width/Spacing | 3.5/3.5 mil |
| Drill Hole Size | Minimum Drill Hole Size 0.20mm |
| Solder Mask Color | Blue |
| Silkscreen Color | White |
| Operating Voltage | 2V to 11V |
| Current Capability | Up to 1.5A per Channel |
| Control Interfaces | PWM Input, Direction Control, Enable Signal |
| Low Power Mode | Sleep Mode for Reduced Standby Power |
| Operating Temperature | -40°C to 125°C |
| Impedance | 10 groups |
| Features | H-Bridge Driving, Overcurrent Protection, Thermal Shutdown, Short Circuit Protection |
| Application Area | Consumer Electronics |






