What Factors Need to be Considered in the Processing of the Four Commonly used PCB Materials?

Currently, in the electronic product processing industry, PCB boards are indispensable as a key electronic component. There are various types of PCB boards available, such as high-frequency PCB boards and microwave PCB boards, which have already gained a certain reputation in the market. PCB manufacturers have specific processing and manufacturing processes for different types of materials.

PCB Boards

Four commonly used PCB materials:

1. FR-4

This is a code for a flame-retardant material grade. It represents a material specification where the resin material must be self-extinguishing after combustion. It is not a material name, but a material grade. Therefore, there are many types of FR-4 grade materials used in general circuit boards, but most are composite materials made of so-called four-function epoxy resin, filler, and glass fiber.

2. Resin

A thermosetting material that undergoes a high-molecular polymerization reaction. Epoxy resin is commonly used in the PCB industry.

Functional characteristics: It has electrical insulation properties and can be used as an adhesive between copper foil and reinforcement (glass fiber cloth). It also has electrical resistance, heat resistance, chemical resistance, and water resistance.

3. Glass fiber cloth

An inorganic material that is fused at high temperature and then cooled to become a non-crystalline hard material, and then woven from warp and weft yarns to form a reinforcing material.

Common E-glass fiber cloth specifications include: 106, 1080, 3313, 2116, 7628.

4. Aluminum substrate

Its base material is, of course, aluminum. It is composed of copper foil, an insulating layer, and an aluminum sheet. It is now commonly used in the LED lighting industry because of its good heat dissipation performance.

In general, PCB board manufacturing and processing must consider the following three major aspects:

1. Material selection

PCB board materials can be mainly divided into two types: organic materials and inorganic materials. Each material has its unique advantages. Therefore, the selection of the material type should consider several characteristics such as dielectric properties, copper foil type, substrate thickness, and processability. Among these factors, the thickness of the surface copper foil is the primary condition affecting the characteristics of printed circuit boards (PCB). Generally, the thinner the thickness, the more advantageous it is for the etching process and for improving the precision of the patterns.

2. Production Process Settings

The environment of the PCB manufacturing workshop is also a very important aspect. The control of working temperature and relative humidity are crucial factors. If the working temperature changes too drastically, it may cause the holes on the board to crack. If the relative humidity is too high, it can negatively affect the properties of materials with strong water absorption, mainly in terms of dielectric properties. Therefore, maintaining appropriate environmental conditions is essential during PCB manufacturing.

3. Production Process Selection

PCB manufacturing is easily affected by various factors. Production processes such as the number of layers, drilling process, and surface coating treatment all affect the quality of the finished PCB. Therefore, when considering these production processes and environments, PCB manufacturing should be considered in conjunction with the characteristics of the manufacturing equipment, and can be flexibly adjusted according to different PCB types and processing requirements.

In summary, PCB manufacturing requires consideration of material selection, production process settings, and production process selection. In addition, the handling of PCB materials and the cutting method are also aspects that require careful consideration, as these are closely related to the surface gloss of the finished printed circuit board.