high-frequency 10GHz multi-layer PCB for communication systems

Three identical green PCB panels with SMT components (chips, resistors, capacitors) and silkscreen labels (5V, P1, U1, Q1, M0TO), viewed from above.

Some information about high-frequency 10GHz multi-layer PCB for communication systems:

TypePCB & PCB Assembly
Industry experience15+years
Place of OriginBaoan,Shenzhen,China
Company NameGREATPCB
Product FeaturesSmaller Size,High precision,Higher Efficiency,High temperature resistance,Low loss,Longer Lifespan…
CertificateITAR REGISTERED,IS013485,ISO 9001:2015,IS045001…
OEM/ODMAcceptatble
Surface treatmentENEPIG,ImAg,OSP,ENIG…
ApplicationAerospace,Computers & Networks,AI & Data Center,Industrial Control,Consumer Electronics,Automotive Electronics…etc
Design SoftwareAutoCAD,Mentor PADS,Cadence Allegro,Altium Designer…
PaymentT/T,DISCOVER,Marst…etc
Nearby portsShenzhen,HK,Guangzhou…
Warranty1 year
One Stop ServicesSourcing Components ,Programming IC,Conformal Coating, Function and Aging Testing
TransportationDHL,EMS,ARAMEX,FedEx…etc
Packing Size95 * 29 * 98 According to container size, standard export package
Terms of deliveryT/T,L/C,Cash,Western Union…
Operating Temperature-40°C to 125°C
Solder mask ColorBlack,Red,Blue, or according to customer requirements
MaterialFR4 /aluminum/ceramic CEM1
After-sales ServiceOnline support
Trading CountryMid east,North america,South america,Southeast asia,Norway,Spanish,Australia,UK,Sweden…
Selling UnitsSingle item
Please note: The above table data is for reference only. For specific information, please contact us

 

Some PCB & Switch Module & Elevator Relay

high-frequency 10GHz multi-layer PCB for communication systems

 

Our workshop for high-frequency 10GHz multi-layer PCB for communication systems

high-frequency 10GHz multi-layer PCB for communication systems

 

Advanced PCB manufacturing equipments

high-frequency 10GHz multi-layer PCB for communication systems

 

The test for high-frequency 10GHz multi-layer PCB for communication systems

high-frequency 10GHz multi-layer PCB for communication systems


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