Via-in-Pad PCB: When to Fill, Cap, Tent or Leave Vias Open
Learn when to fill, cap or tent via-in-pad designs, compare BGA and QFN requirements, and prepare clear PCB manufacturing notes.
Learn when to fill, cap or tent via-in-pad designs, compare BGA and QFN requirements, and prepare clear PCB manufacturing notes.
Plan a PCB pilot build with practical checks for revisions, component changes, first-article inspection, testing and production release.
Compare solder mask and conformal coating, learn when to use both, and plan coating keep-outs, inspection and assembly requirements.
Learn how PCB mouse bites work, compare breakaway tabs with V-cuts, and review hole spacing, edge clearance and panel files before assembly.
A practical guide to PCB placement files: what the fields mean, how export settings change the output, and what to check before assembly.
Prepare a clearer PCB assembly BOM with practical field explanations, a worked review example, export checks and guidance on supporting manufacturing files.
Understand global, local and panel fiducials, distinguish copper diameter from mask opening, and check your design before PCB assembly.
PCB assembly lead time depends on more than placement speed. Learn how materials, files, production preparation, testing and shipping affect your schedule.